Wireless Power Transfer Systems;

RFIC design;

Design, analysis and electromagnetic modeling of active and passive devices.

EMI/EMC

• D. Sengupta, A. Weisshaar, (in press), “Enhanced Magnetic Field Shielding with Metamaterial Hourglass Lens,”, 26th IEEE Workshop on Signal and Power Integrity (SPI 2022), Siegen, Germany, May 22-25, 2022.
• D. Sengupta, A. Weisshaar, (1 page abstract), “Metamaterial Hourglass Lens Design for Enhanced Magnetic Shielding,”, Progress In Electromagnetics Research Symposium (PIERS 2021), Hangzhou, China, April 25-27,2022.

• D. Sengupta, S. Gaskill, A. Weisshaar, “A Lumped Element Circuit Model for Monolithic Transformers in Silicon-based RFICs,” IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2014), Portland, Oct 26-29, 2014, pp. 63-66.
• D. Sengupta, V. Maheswari, R. Kar, “Unified Delay Analysis for On-Chip RLCG Interconnects for Ramp Input using Fourth Order Transfer Function,” IEEE International Conference on Signal And Image Processing (ICSIP 2010), Chennai, Dec 15-17, 2010, pp. 357-361.
• V. Maheshwari, D. Sengupta, R. Kar, D. Mandal, A.K.Bhattacharjee, “Analytical Delay Model for Distributed On-Chip RLCG Global Interconnects for Different Pole Conditions,” ACEEE Int. J. on Electrical and Power Engineering, Vol. 02, No. 03, Nov 2011, pp. 9-13.