PhotonIcs and Electromagnetics Research Symposium,
also known as Progress In Electromagnetics Research Symposium
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Published by The Electromagnetics Academy

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Published: 2015-07-09
Challenges for Silicon Photonics Based Mid Board Modules to Achieve High Data Rate Transmissions
By
Stephane Bernabe,
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    Stephane Bernabe

    University Grenoble Alpes, France

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Christophe Kopp,
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    Christophe Kopp

    University Grenoble Alpes, France

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Benjamin Blampey,
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    Benjamin Blampey

    University Grenoble Alpes, France

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O. Castany,
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    O. Castany

    University Grenoble Alpes, France

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A. Myko,
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    A. Myko

    University Grenoble Alpes, France

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K. Rida
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    K. Rida

    University Grenoble Alpes, France

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Progress In Electromagnetics Research, Vol. 185, 17-48, 2026
doi:10.2528/PIER26011404
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Abstract
We present a review of homogenization models of microwave wire media with different geometries. We begin with a simple (uniaxial) wire medium and then consider more complex types of wire media - double, triple, and interlaced wire media - which remain underexplored. We discuss boundary problems with wire media and the most important physical effects revealed using the reviewed homogenization models.
Citation
Stephane Bernabe, Christophe Kopp, Benjamin Blampey, O. Castany, A. Myko, and K. Rida, "Challenges for Silicon Photonics Based Mid Board Modules to Achieve High Data Rate Transmissions," Proceedings of 2026 Photonics & Electromagnetics Research Symposium, Suzhou, China, 27 - 31 July
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