Session Information

As integration density increases, the coupled Multiphysics processes, including electromagnetics, quantum transport, heat conduction and strain, induce severe performance and reliability degradation of advanced electronic devices and integrated circuits, thus leading to challenges in the Multiphysics compatibility design. Multiphysics modeling and simulation is necessary for Multiphysics compatibility design. This session aims at providing a platform to share recent progresses in modeling and simulation methods and applications of advanced devices and integrated circuits/structures.