Session
1A5
Microelectronic Packaging
Organized by Henning Braunisch and Kaladhar Radhakrishnan
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- A Hybrid Time-domain Method for Electromagnetic Problems
in Microelectronic Packaging
T. Xiao, M. Chai, and Q. H. Liu
pp. 202 [ PDF (81KB)]
- Effects from the Thin Metallic
Substrate Sandwiched in Planar Multilayer Microstrip Lines
L. Zhang and J. M. Song
pp. 203-207 [ PDF (352KB)]
- Modeling of Randomly Rough Surface Effects on Absorptions
by Conductors at Microwave Frequencies
X. Gu, L. Tsang, and H. Braunisch
pp. 208 [ PDF
(81KB)]
- Krylov Model Order Reduction of Finite Element Models
of Packaging Structures with Embedded Frequency-dependent Multiports
H. Wu and A. C. Cangellaris
pp. 209 [ PDF
(138KB)]
- Enabling Accelerated Boundary-element Design Tools
for Packaging and Interconnects
S. Chakraborty and V. Jandhyala
pp. 210 [ PDF
(81KB)]
- Noise Source Characterization on the PDN for EMI
M. Lai, V. Ricchiuti, A. Orlandi, B. Archambeault, G. Antonini,
D. J. Pommerenke, and J. L. Drewniak
pp. 211 [ PDF
(95KB)]
- Fast Method for Analysis of Electromagnetic Bandgap
Structures Used in Power Delivery Networks
A. Tavallaee and R. Abhari
pp. 212 [ PDF
(82KB)]
- Extraction of Chip Power Delivery Current and Activity
Variations
I. Kantorovich, V. Drabkin, C. Houghton, and J. St. Laurent
pp. 213-218 [ PDF
(888KB)]
- High Speed and Low Noise Packaging Design Methodologies
for 40 Gbps SerDes Channel with PBGA Type Package
D. G. Kam, J. Yu, H. Choi, K. Bae, J. Kim, D.-K. Jeong, C. Lee,
and J. Kim
pp. 219 [ PDF
(95KB)]
- 3D-SOP Millimeter-wave Functions for High Data Rate
Wireless Systems Using LTCC and LCP Technologies
J.-H. Lee, D. Thompson, S. Pinel, J. Papapolymerou, and M. M.
Tentzeris
pp. 220 [ PDF
(140KB)]
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