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PIERS2019 Rome Focus/Special Sessions

Photonics Packaging & Integration 2

Organized by Dr. Francesco Floris (University College Cork)

Session's Information:

Integrated photonics is a promising route toward high-performance next-generation ICT and sensing devices. Many foundries currently offer dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs). These provide researchers and small-to-medium enterprises (SMEs) an affordable route to design and fabrication of their own PICs. While these bare PICs are adequate for testing new device and circuit designs on probe-stations, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into suitable and durable modules. Photonic packaging is the most significant bottleneck in the development of commercially relevant integrated photonic devices. Photonic packaging can account for over 50% of the photonic product manufacturing cost, orders of magnitude more expensive than electronic packaging. The main driver for this is the need for sub-micron alignment tolerances of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Consequently, it is vital that everybody (from undergraduate, graduate and PhD students to researchers and industries) involved in developing photonic-based products have an understanding as a whole of the materials, technologies and processes required to package photonic devices. In the session, we welcome contributions dealing with, but not limited to: ● optical, electrical, thermal and mechanical aspects of packaging technologies; ● education and training; ● packaging equipment development and photonic device foundry services.

Organizer's Information:

Dr. Francesco Floris University College Cork

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