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|Photonics Packaging & Integration 1|
| Organized by Dr. Francesco Floris (University College Cork)|
|Integrated photonics is a promising route toward high-performance next-generation ICT and sensing devices. Many foundries currently offer dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs). These provide researchers and small-to-medium enterprises (SMEs) an affordable route to design and fabrication of their own PICs. While these bare PICs are adequate for testing new device and circuit designs on probe-stations, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into suitable and durable modules.|
Photonic packaging is the most significant bottleneck in the development of commercially relevant integrated photonic devices. Photonic packaging can account for over 50% of the photonic product manufacturing cost, orders of magnitude more expensive than electronic packaging. The main driver for this is the need for sub-micron alignment tolerances of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration.
Consequently, it is vital that everybody (from undergraduate, graduate and PhD students to researchers and industries) involved in developing photonic-based products have an understanding as a whole of the materials, technologies and processes required to package photonic devices.
In the session, we welcome contributions dealing with, but not limited to:
● optical, electrical, thermal and mechanical aspects of packaging technologies;
● education and training;
● packaging equipment development and photonic device foundry services.
- Dr. Francesco Floris
University College Cork
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