PIERS 2016 in Shanghai
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PIERS
Progress In Electromagnetics Research Symposium 

PIERS 2016 in Shanghai, China, 8 August - 11 September, 2016

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PIERS2016 Shanghai Focus/Special Sessions  
SC3: Silicon-plus Photonics for High Density Optical Interconnects
Organized by Prof. Daoxin Dai (Zhejiang University) and Prof. Liu Liu (South China Normal University)
 
Session's Information:
High density optical interconnect is becoming more and more important, and various compact and functioning photonic integrated devices are needed. Silicon photonics has become very popular due to its compatibility with mature CMOS technologies with excellent processing control, low cost, and high volume processing. In the past decade, silicon photonics has achieved great progresses. However, it is still very difficult to realize some photonic functions needed for large-scale photonic integration on pure silicon due to the intrinsic properties of the silicon material. An effective solution is to develop silicon-plus photonics by introducing other materials to complement the disadvantages of silicon. People have already tried to put various materials on silicon, e.g., metals, III-V semiconductors, group IV materials (like Ge, Graphene, etc), polymer, magnetic-optical materials, liquid crystals, etc. In this way, silicon-plus photonics is considered a very powerful and useful platform for various applications for optical interconnects, as well as for optical sensing, in the wavelength range from visible to the mid-infrared.
 
Organizer's Information:

  • Prof. Daoxin Dai
    Zhejiang University

  • Prof. Liu Liu
    South China Normal University

   
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